Title:
放熱部材、半導体装置、及び複合材料の製造方法
Document Type and Number:
Japanese Patent JP5645048
Kind Code:
B2
Inventors:
岩山 功
河合 千尋
河合 千尋
Application Number:
JP2009242791A
Publication Date:
December 24, 2014
Filing Date:
October 21, 2009
Export Citation:
Assignee:
住友電気工業株式会社
International Classes:
C22C1/10; C22C23/00; C22C26/00; H01L23/373; H05K7/20
Attorney, Agent or Firm:
Hiroshi Yamano