Title:
キット及び半導体チップの製造方法
Document Type and Number:
Japanese Patent JP7256851
Kind Code:
B2
Abstract:
To provide a kit including a curable resin film that can improve the strength of a semiconductor chip, can prevent peeling of a protective film, and is excellent in reworkability when attached to the rear face of a semiconductor wafer.SOLUTION: A kit includes: a first curable resin film (x1) for forming a first cured resin film (r1) as a protective film on both a bump formation surface including bumps and side faces of a semiconductor chip having the bump formation surface; and a second curable resin film (x2) for forming a second cured resin film (r2) as a protective film on a surface on the opposite side of the bump formation surface of the semiconductor chip. The peel force of the second curable resin film (x2) with respect to a silicon wafer (mirror plane) is 3,000 mN/25 mm or less.SELECTED DRAWING: Figure 1
Inventors:
Tomonori Shinoda
Taku Nemoto
Sakurako Tamura
Tomo Morishita
Keisuke Shinomiya
Taku Nemoto
Sakurako Tamura
Tomo Morishita
Keisuke Shinomiya
Application Number:
JP2021144129A
Publication Date:
April 12, 2023
Filing Date:
September 03, 2021
Export Citation:
Assignee:
LINTEC CORPORATION
International Classes:
H01L21/301; B32B3/30; H01L21/304; H01L21/683; H01L23/29; H01L23/31
Domestic Patent References:
| JP2016076694A | ||||
| JP2019106420A | ||||
| JP2002100709A | ||||
| JP2009088109A |
Foreign References:
| WO2018147097A1 | ||||
| US20080318396 |
Attorney, Agent or Firm:
Patent Attorney Corporation Otani Patent Office
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