Title:
MANUFACTURING METHOD OF LAMINATED CERAMIC ELECTRONIC COMPONENT, CERAMIC GREEN SHEET, AND LAMINATED CERAMIC ELECTRONIC COMPONENT
Document Type and Number:
Japanese Patent JP2020198359
Kind Code:
A
Abstract:
To manufacture a laminated ceramic electronic component with excellent flatness on the main surface and suppressed poor connection of through holes.SOLUTION: In a step of filling a through hole 3 with a conductive paste 5, a closed space 6 is formed between an inner bottom surface 4a of a bottom hole 4 and a conductive paste 5 filled in the through hole 3, and in a step of drying the filled conductive paste 5, the air pressure inside the closed space 6 is higher than the air pressure around a carrier film 1 and a ceramic green sheet 2 at at least one of the start time point and the intermediate time point of the step.SELECTED DRAWING: Figure 2
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Inventors:
KOBAYASHI KENICHI
HISAYASU JUNJI
HISAYASU JUNJI
Application Number:
JP2019103397A
Publication Date:
December 10, 2020
Filing Date:
May 31, 2019
Export Citation:
Assignee:
MURATA MANUFACTURING CO
International Classes:
H01G4/30; H01F17/00; H01G13/00; H05K1/11; H05K3/40; H05K3/46
Domestic Patent References:
| JP2001148570A | 2001-05-29 | |||
| JPS6084711A | 1985-05-14 | |||
| JPH01253994A | 1989-10-11 | |||
| JP2003101236A | 2003-04-04 |
Attorney, Agent or Firm:
Nao Kawamoto