MANUFACTURING METHOD FOR LAMINATED CERAMIC ELECTRONIC COMPONENT

Japanese Patent JP3954792

B2

PROBLEM TO BE SOLVED: To provide a method for the manufacture of a laminated ceramic electronic component which can reduce rejection rate due to the short circuit or the like of an internal electrode, even if a dielectric layer is made progressively thin and multilayer and which has superior workability and handleability, when it is mounted on various boards or the like.
SOLUTION: The manufacturing method is provided with a first lamination process, where a first-face-side sheet block (2a) containing at least one dielectric green sheet layer is laminated on the first face (102a) of a reference sheet block (10a), containing at least one dielectric green sheet layer and the first-face-side sheet block is contact- bonded to the reference sheet block by applying pressure; a second lamination process, where a second-face-side sheet block (2b) containing at least one dielectric green sheet layer is laminated on the second face (102b) on the opposite side of the first face of the reference sheet block to which the first-face-side sheet block is contact- bonded and the second-face-side sheet block is contact-bonded to the reference sheet block by applying a pressure; and a process, where pressure is applied to an unfired laminated raw body obtained, by alternately performing the first lamination process and the second lamination process.

Nakano Yukie
Takeshi Nomura

JP2000336347A

August 08, 2007

November 02, 2000

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tdk Corporation

H01G4/12; H01G4/30; (IPC1-7): H01G4/12; H01G4/30

JP6342736A
JP8316092A
JP2000244130A
JP7171818A
JP10172864A
JP11111560A
JP11260661A

Hitoshi Maeda

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