To provide a manufacturing method of a laminated foil for forming a multi-layer wiring board with which a wiring board capable of coping with high density can be provided at a lower cost, by forming a wiring board using a laminated foil having a surface layer consisting of metal or an alloy with a low-melting point and using a selective etching technique and a diffusion joining technique, and to provide a manufacturing method of a multi-layer wiring board using the same.

In the laminated foil for forming a multi-layer wiring board, a surface layer made of a metal or an alloy having a melting point not greater than 350°C is formed on both surfaces or one surface of a laminated foil, in which an intermediate layer made of a metal or an alloy having an etching characteristic being different from that of a Cu foil or a Cu alloy foil is arranged so as to be sandwiched by the Cu foil or the Cu alloy foil.