Title:
積層体およびフレキシブルデバイスの製造方法
Document Type and Number:
Japanese Patent JP6571094
Kind Code:
B2
Abstract:
The present invention provides a laminate which exhibits excellent adhesiveness between a heat resistant resin film having a flexible substrate layer and an inorganic substrate, and in which the flexible substrate layer can be separated from the inorganic substrate easily and in a short amount of time. A laminate 100 has an inorganic substrate 1 and a heat resistant resin film 2 formed on the inorganic substrate, and is characterized by the following: (1) the heat resistant resin film 2 has a flexible substrate layer 21 and a sacrificial layer 22 provided on an outer edge of the flexible substrate layer; (2) the adhesive strength between the flexible substrate layer 21 and the inorganic substrate 1 is 2 N/cm or less; (3) the adhesive strength between the sacrificial layer 22 and the inorganic substrate 1 is greater than 2 N/cm; and (4) the adhesive strength between the sacrificial layer 22 and the inorganic substrate 1 is made to be 2 N/cm or less by post-processing.
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Inventors:
Shigeta Akira
Takeshi Yoshida
Yumi Yamada
Tatsuya Morikita
Muneki Yamada
Masahiro Hosoda
Yoshiaki Echigo
Takeshi Yoshida
Yumi Yamada
Tatsuya Morikita
Muneki Yamada
Masahiro Hosoda
Yoshiaki Echigo
Application Number:
JP2016548892A
Publication Date:
September 04, 2019
Filing Date:
September 15, 2015
Export Citation:
Assignee:
UNITIKA LTD.
International Classes:
B32B9/00; B32B27/34; G02F1/1333; H01L21/02; H01L27/12
Domestic Patent References:
| JP2014022459A | ||||
| JP2013168445A | ||||
| JP2011142168A | ||||
| JP2007251080A |
Foreign References:
| WO2013114685A1 | ||||
| WO2014041816A1 | ||||
| WO2014119648A1 |
Attorney, Agent or Firm:
Samejima Mutsumi
Kitahara Yasuhiro
Kitahara Yasuhiro