Title:
リードフレーム、コンタクト群の製造方法、及びコネクタの製造方法
Document Type and Number:
Japanese Patent JP5871552
Kind Code:
B2
Abstract:
By using a lead frame as an intermediate member, a contact group of a connector is manufactured. The lead frame includes a plurality of first leads arranged on a plane and spaced from one another, a plurality of pairs of second leads, each pair being arranged on the plane between the first leads, and a connecting portion connecting the first and the second leads on one end side. The second leads have a pitch which is greater on the other end side than that on the one end side to make the second leads approach the first leads on the other end side, respectively. The lead frame further includes bridge portions connecting approached ones of the first and the second leads to each other at a portion where an interval between the first and the second leads is reduced.
Inventors:
Masayuki Shiratori
Shuichi Aihara
Masayuki Katayanagi
Toru Hashiguchi
Shuichi Aihara
Masayuki Katayanagi
Toru Hashiguchi
Application Number:
JP2011224033A
Publication Date:
March 01, 2016
Filing Date:
October 11, 2011
Export Citation:
Assignee:
Japan Aviation Electronics Industry Co., Ltd.
International Classes:
H01R13/6585; H01R13/6471
Domestic Patent References:
| JP2005149770A | ||||
| JP2008041656A |
Foreign References:
| US4327958 |
Attorney, Agent or Firm:
Kenho Ikeda
Shuichi Fukuda
Takashi Sasaki
Shuichi Fukuda
Takashi Sasaki