Title:
リードフレーム、発光装置用パッケージ、発光装置及び発光装置の製造方法
Document Type and Number:
Japanese Patent JP6635152
Kind Code:
B2
Abstract:
A lead frame includes a base material and two or more silver-containing layers. The base material is composed of a metal. The two or more silver-containing layers are stacked on the base material. The two or more silver-containing layers include an uppermost silver-containing layer containing sulfur, and a lower silver-containing layer. The lower silver-containing layer contains no selenium or the lower silver-containing layer is composed substantially only of silver. A method for manufacturing a light emitting device includes: preparing a lead frame; preparing a package including the lead frame; and mounting a light emitting element on the package. The lead frame is prepared by: providing a base material; forming an underlying metal on the base material by plating to form an underlayer; and forming two or more silver-containing stacked layers on the underlayer, the two or more silver-containing stacked layers including an uppermost silver-containing layer containing sulfur.
Inventors:
Kato Yasuo
Application Number:
JP2018134266A
Publication Date:
January 22, 2020
Filing Date:
July 17, 2018
Export Citation:
Assignee:
Nichia Corporation
International Classes:
C25D7/00; C25D5/10; C25D5/12; H01L23/48; H01L33/62
Domestic Patent References:
| JP2008091818A | ||||
| JP2016122828A | ||||
| JP2012028630A | ||||
| JP2014179458A |
Attorney, Agent or Firm:
Shinki Global IP Patent Corporation