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Patent Searching and Data


Title:
発光装置の製造方法
Document Type and Number:
Japanese Patent JP7458582
Kind Code:
B2
Abstract:
A method for manufacturing a light-emitting device includes: providing a plurality of first light-emitting elements, each comprising a joining portion containing gold; providing a support member including: a substrate, and a plurality of wiring portions, each disposed on the substrate and containing gold; joining the joining portions of the first light-emitting elements and corresponding wiring portions of the plurality of wiring portions under a first joining condition; evaluating whether at least one first light-emitting element of the plurality of first light-emitting elements is removable from the support member; evaluating electrical characteristics of each of the plurality of first light-emitting elements; and if the at least one first light-emitting element is removed from the support member, removing from the support member a first light-emitting element determined to be defective in the step of evaluating electrical characteristics of each of the plurality of first light-emitting elements.

Inventors:
Koji Nishino
Application Number:
JP2022084439A
Publication Date:
April 01, 2024
Filing Date:
May 24, 2022
Export Citation:
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Assignee:
Nichia Corporation
International Classes:
G09F9/00; G09F9/33; H01L33/00
Domestic Patent References:
JP2010003978A
JP2009302145A
JP2021144970A
JP2020102616A
JP2015500562A
JP2020188037A
JP2019153783A
JP2020074005A
Foreign References:
CN112071798A
US20210249395
CN203787424U
Attorney, Agent or Firm:
Masahiko Hyugaji
Junichi Kozaki
Takato Uchida