Title:
発光ダイオード装置の製造方法
Document Type and Number:
Japanese Patent JP5800640
Kind Code:
B2
Abstract:
A method for producing a light emitting diode device includes the steps of preparing a laminate (1) including a supporting layer (2), a constraining layer (3) formed at one side in a thickness direction of the supporting layer (2), and the encapsulating resin layer (5) formed at one side in the thickness direction of the constraining layer and made of an encapsulating resin; cutting the encapsulating resin layer and the constraining layer in the laminate into a pattern corresponding to the light emitting diode element (21); removing a portion which does not correspond to the light emitting diode element in the encapsulating resin layer and the constraining layer that are cut into the pattern; allowing the encapsulating resin layer corresponding to the light emitting diode element (21) to be opposed to the light emitting diode element to be pressed in the direction where they come close to each other so as to encapsulate the light emitting diode element (21) by the encapsulating resin layer (5); and removing the supporting layer (2) and the constraining layer (3) from the laminate.
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Inventors:
Kyoya Oyabu
Hiroyuki Katayama
Daisuke Tsukahara
Munehisa Mitani
Hiroyuki Katayama
Daisuke Tsukahara
Munehisa Mitani
Application Number:
JP2011186953A
Publication Date:
October 28, 2015
Filing Date:
August 30, 2011
Export Citation:
Assignee:
NITTO DENKO CORPORATION
International Classes:
H01L33/52; H01L23/29; H01L23/31
Domestic Patent References:
| JP2011159874A | ||||
| JP2009212511A | ||||
| JP2005028734A | ||||
| JP2010123802A |
Attorney, Agent or Firm:
Hiroyuki Okamoto
Shinichi Uda
Shinichi Uda