Title:
発光素子の製造方法
Document Type and Number:
Japanese Patent JP4886015
Kind Code:
B2
Abstract:
A laser processing method which can highly accurately cut objects to be processed having various laminate structures is provided. An object to be processed comprising a substrate and a laminate part disposed on the front face of the substrate is irradiated with laser light L while a light-converging point P is positioned at least within the substrate, so as to form a modified region due to multiphoton absorption at least within the substrate, and cause the modified region to form a starting point region for cutting. When the object is cut along the starting point region 7 for cutting, the object 1 can be cut with a high accuracy.
Inventors:
Fukuyo Bunji
Kenji Fukumitsu
Naomi Uchiyama
Kenji Fukumitsu
Naomi Uchiyama
Application Number:
JP2009214743A
Publication Date:
February 29, 2012
Filing Date:
September 16, 2009
Export Citation:
Assignee:
Hamamatsu Photonics Co., Ltd.
International Classes:
B23K26/38; B23K26/40; B28D1/22; B28D5/00; C03B33/02; C03B33/033; C03B33/07; H01L21/301; H01L33/30; H01S5/323
Domestic Patent References:
| JP11163403A | ||||
| JP4111800A | ||||
| JP2000323441A | ||||
| JP4167985A |
Attorney, Agent or Firm:
Yoshiki Hasegawa
Arai Tohio
Shiro Terasaki
Satoru Ishida
Arai Tohio
Shiro Terasaki
Satoru Ishida