Title:
MANUFACTURING METHOD FOR LIQUID EJECTION HEAD
Document Type and Number:
Japanese Patent JP2023161163
Kind Code:
A
Abstract:
To prevent a sealant from adhering to a jig.SOLUTION: A manufacturing method for a liquid ejection head, having a recording-element substrate 101 with a pad 103 electrically connected to an energy generating element and a wiring substrate 102 with a lead 104 to be electrically connected to the pad 103, includes steps of: disposing the recording-element substrate 101 and the wiring substrate 102 on a jig 108; electrically connecting the pad 103 and the lead 104 by a wire bonding method; retracting the jig 108, disposed at a lower part of the lead 104, from this lower part; and coating an electrically connected part of the pad 103 and the lead 104, with a sealant 106.SELECTED DRAWING: Figure 3
Inventors:
OTAKA SHINPEI
YASHIRO TAKANORI
YASHIRO TAKANORI
Application Number:
JP2022071343A
Publication Date:
November 07, 2023
Filing Date:
April 25, 2022
Export Citation:
Assignee:
CANON KK
International Classes:
B41J2/16
Attorney, Agent or Firm:
Takuma Abe
Sougo Kuroiwa
Sougo Kuroiwa
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