To provide a manufacturing method of an MEMS element, with enhanced yield by securely releasing a MEMS structure, as well as attaining high reliability.
This manufacturing method of the MEMS element 10 includes a step for forming the MEMS element 10 which has the MEMS structure 11 formed by eliminating a sacrificing layer 22 by release etching, and a step for forming a monitor element 20 which has a plurality of monitor fingers formed by eliminating the sacrificing layer 22 by the release etching. The plurality of MEMS elements 10 are arranged lengthwise and crosswise of a main face of a substrate wafer 1. The monitor element 20 is dispersedly arranged between the MEMS elements 10. A first monitor finger 30 and a second monitor finger 50 are formed in the monitor elements 20. The position of boundary face of the first monitor finger 30 and the second monitor finger 50, and the release etching is visually recognized to confirm the condition of the release of the MEMS structure 11.
SATO AKIRA
| JP2008516267A | 2008-05-15 | |||
| JP2000068527A | 2000-03-03 | |||
| JP2001298012A | 2001-10-26 | |||
| JPH11274142A | 1999-10-08 | |||
| JPS6446934A | 1989-02-21 |
| US6750152B1 | 2004-06-15 |
Fujitsuna Hideyoshi
Osamu Suzawa