Title:
金属配線接合構造の製法
Document Type and Number:
Japanese Patent JP6715703
Kind Code:
B2
Abstract:
A connection FPC 75 includes a plurality of metal wires 750 between a support layer 751 and a covering layer 752, and an exposed region including contacts 753 serving as end portions of the metal wires 750 is exposed from the covering layer 752. A bending-position guide 760 is provided on the surface of the support layer 751 opposite from the surface on which the metal wires 750 are provided. An edge 760a of the bending-position guide 760 serves as a bending line along which the connection FPC 75 is bent and is disposed in a covering-layer projection area E where the covering layer 752 is projected on the support layer 751. The connection FPC 75 is bent at portions of the metal wires 750 covered with the covering layer 752, that is, at reinforced portions.
Inventors:
Takebayashi Hiroshi
Natsuki Hirata
Kim Shun
Natsuki Hirata
Kim Shun
Application Number:
JP2016128767A
Publication Date:
July 01, 2020
Filing Date:
June 29, 2016
Export Citation:
Assignee:
Nippon Insulator Co., Ltd.
International Classes:
H05K1/02; H05K3/36
Domestic Patent References:
| JP2003069164A | ||||
| JP2007194459A | ||||
| JP9214082A | ||||
| JP2008288356A | ||||
| JP2007292838A |
Attorney, Agent or Firm:
Aitec International Patent Office