Title:
メタライズドセラミック基板チップの製造方法
Document Type and Number:
Japanese Patent JP5037521
Kind Code:
B2
Inventors:
Yasuyuki Yamamoto
Koichi Yamamoto
Masakatsu Maeda
Koichi Yamamoto
Masakatsu Maeda
Application Number:
JP2008547038A
Publication Date:
September 26, 2012
Filing Date:
November 29, 2007
Export Citation:
Assignee:
Tokuyama Corporation
International Classes:
H05K3/00; B28D1/24; B28D5/00; C04B41/91; H01L23/13; H05K1/02
Domestic Patent References:
| JP2005101164A | 2005-04-14 | |||
| JPH09107159A | 1997-04-22 | |||
| JP2002232118A | 2002-08-16 | |||
| JP2005159184A | 2005-06-16 | |||
| JPH0236094A | 1990-02-06 |
Attorney, Agent or Firm:
Noriyuki Yamamoto
Akihiko Yamashita
Kishimoto Tatsuto
Akihiko Yamashita
Kishimoto Tatsuto