Title:
MANUFACTURING METHOD OF MOLDED STRUCTURE
Document Type and Number:
Japanese Patent JP2021079554
Kind Code:
A
Abstract:
To suppress a situation where a molten resin for molding a molded body leaks between a base material and a molded surface.SOLUTION: The manufacturing method of a molded structure comprises: a film arrangement step of arranging a film 80 so as to cover a molded surface 61A of a lower die 61 by suction of the film 80 to the molded surface 61A, and closing an opening 67A of a runner 67 recessed on the molded surface 61A by the film 80; a base material molding step, performed after the film arrangement step, of arranging a pre-board P1 between the film 80 arranged on the molded surface 61A and a molded surface 51A of an upper die 51, and then press-molding the pre-board P1 in a state of being heated with the lower die 61 and the upper die 51; and a molded body molding step, performed after the base material molding step, of molding a second rib 22 in a state of being joined to a trim board 20 through the film 80 by injecting a molten resin to the runner 67 in a state where the trim board 20 is pressed by the lower die 61 and the upper die 51.SELECTED DRAWING: Figure 6
More Like This:
Inventors:
KAWAJIRI HIDEKI
Application Number:
JP2019206046A
Publication Date:
May 27, 2021
Filing Date:
November 14, 2019
Export Citation:
Assignee:
TOYOTA BOSHOKU CORP
International Classes:
B29C45/16
Attorney, Agent or Firm:
Akatsuki Joint Patent Office