Title:
積層セラミック電子部品の製造方法
Document Type and Number:
Japanese Patent JP4461872
Kind Code:
B2
Inventors:
Makoto Matsuda
Hiroki Awata
Hiroki Awata
Application Number:
JP2004092992A
Publication Date:
May 12, 2010
Filing Date:
March 26, 2004
Export Citation:
Assignee:
MURATA MANUFACTURING CO.,LTD.
International Classes:
H01G4/12; H01G4/30; H01G13/00
Domestic Patent References:
| JP6349671A | ||||
| JP2003338426A | ||||
| JP8078273A | ||||
| JP6224002A | ||||
| JP2000173881A |
Attorney, Agent or Firm:
宮▲崎▼ 主税