Title:
積層セラミック電子部品の製造方法およびそれに用いる組立て冶具
Document Type and Number:
Japanese Patent JP6838346
Kind Code:
B2
Abstract:
PROBLEM TO BE SOLVED: To provide a method for manufacturing a multilayer ceramic electronic component capable of precisely joining a first metal terminal and a second metal terminal with respective plurality of electronic component bodies while maintaining productivity.SOLUTION: A method for manufacturing a multilayer ceramic electronic component includes a process for preparing a first terminal frame section 80a including a plurality of first terminal sections 82a to be a first metal terminal 70a and a first terminal coupling section 84a for integrally coupling at an upper section of the plurality of first terminal sections 82a, and a second terminal frame section 80b having a same structure, and a process for depressing the first terminal section 82a and a second terminal section 82b against the respective plurality of electronic component bodies 20 using an assembly jig 100 to join the first terminal section 82a and the second terminal section 82b with respective plurality of electronic component bodies 20 by performing reflow with the state being maintained.SELECTED DRAWING: Figure 9
Inventors:
Hideki Otsuka
Itagaki Kaiji
Itagaki Kaiji
Application Number:
JP2016205352A
Publication Date:
March 03, 2021
Filing Date:
October 19, 2016
Export Citation:
Assignee:
MURATA MANUFACTURING CO.,LTD.
International Classes:
H01G4/30; H01G13/00
Domestic Patent References:
| JP2015008270A | ||||
| JP2003220466A | ||||
| JP2015062214A | ||||
| JP2000306769A |
Attorney, Agent or Firm:
Masahiro Okada
Ichi Ogiya
Ichi Ogiya