To prevent the manufacture of a defective IC card to reduce the waste of parts and a material as much as possible.

In the manufacturing method of a non-contact type IC card, whether each IC formed on a wafer operates normally or not, is inspected and specific data is written in a nonvolatile memory inside the IC whose result of inspection is normal after a semiconductor process of the wafer is completed when an IC chip for mounting on the IC card is manufactured. According to this configuration, when an antenna is formed on a filmlike substrate and the IC chip is mounted, the contents of the memory inside the IC chip are read to judge whether the IC chip is a defective product or not.