Title:
光半導体素子の製造方法、サセプタおよびその製造方法
Document Type and Number:
Japanese Patent JP7056436
Kind Code:
B2
Abstract:
To provide a method of manufacturing an optical semiconductor element, and a susceptor and a method of manufacturing the same capable of optimizing positions of small pieces and suppressing contamination.SOLUTION: A method of manufacturing an optical semiconductor element includes the following steps of: laminating a plurality of compound semiconductor layers on a first compound semiconductor substrate; dividing the first compound semiconductor substrate to form small pieces from the first compound semiconductor substrate; arranging the small pieces at openings of a susceptor; forming a waveguide mesa on a first substrate containing silicon; and making the susceptor and the first substrate face each other and bonding between the small pieces and the first substrate.SELECTED DRAWING: Figure 4
Inventors:
Naoko Konishi
Yagi Hideki
Yagi Hideki
Application Number:
JP2018138725A
Publication Date:
April 19, 2022
Filing Date:
July 24, 2018
Export Citation:
Assignee:
Sumitomo Electric Industries, Ltd.
International Classes:
G02F1/025; H01S5/026
Domestic Patent References:
| JP2004537158A | ||||
| JP10274729A | ||||
| JP2014192234A | ||||
| JP2013073959A |
Foreign References:
| WO2017197132A1 | ||||
| US20090245298 | ||||
| WO2003056669A1 | ||||
| CN1491436A |
Attorney, Agent or Firm:
Shuhei Katayama