Title:
MANUFACTURING METHOD OF PACKAGE
Document Type and Number:
Japanese Patent JP2006049353
Kind Code:
A
Abstract:
To improve temporary sealing process of seam welding and to reduce manufacturing cost.
Temporary sealing is conducted using a bonding member before a sealing part and a metal cover of an electronic component package are sealed in the manufacturing method of an electronic component package wherein the small size electronic component is sealed in the seam using the metal cover.
Inventors:
MINAMI KAZUAKI
KOBAYASHI HIROKAZU
NASU YOSHINORI
KOBAYASHI HIROKAZU
NASU YOSHINORI
Application Number:
JP2004224012A
Publication Date:
February 16, 2006
Filing Date:
July 30, 2004
Export Citation:
Assignee:
KYOCERA KINSEKI CORP
International Classes:
H01L23/02
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