Title:
Manufacturing method of packaging material for molding
Document Type and Number:
Japanese Patent JP6347613
Kind Code:
B2
Abstract:
PROBLEM TO BE SOLVED: To produce a packaging material for molding in which adhesion between a heat-resistant resin layer as an outer layer and an adhesive layer can be enhanced.SOLUTION: A process of producing a packaging material for molding in which a heat-resistant resin layer (2), a first adhesive layer (5), a metal foil layer (4), a second adhesive layer, and a heat-fusible resin layer are laminated in this order from the outside includes the steps of: applying an adhesive composition (5a) constituting the first adhesive layer (5) to the heat-resistant resin layer (2); drying the adhesive composition (5a); and thereafter sticking the heat-resistant resin layer (2) and the metal foil layer (4) together.
Inventors:
Miyajima Michi
Application Number:
JP2014017409A
Publication Date:
June 27, 2018
Filing Date:
January 31, 2014
Export Citation:
Assignee:
Showa Denko Packaging Co., Ltd.
International Classes:
B32B27/00; B32B15/08; B32B27/34; B32B27/36; B65D1/00; B65D65/40; H01M2/02
Domestic Patent References:
| JP2013149560A | ||||
| JP2010116422A | ||||
| JP2002110111A |
Foreign References:
| US20040234792 |
Attorney, Agent or Firm:
Yoshihito Shimizu
Hisayoshi Shimizu
Hisayoshi Shimizu