Title:
包装体の製造方法
Document Type and Number:
Japanese Patent JP6682312
Kind Code:
B2
Abstract:
PROBLEM TO BE SOLVED: To surely cut a heat-shrinkable cylindrical label with laser, and form an opening.SOLUTION: A package manufacturing method includes: a mounting step in which a heat-shrinkable cylindrical label 4 cylindrically formed of a label base material 31 with heat shrinkability in lateral and longitudinal directions and 7-40% of thermal shrinkage in the longitudinal direction with the lateral direction as a circumferential direction, is mounted on a container 1; and a cutting step in which a part in the surface of the post-mounted heat-shrinkable cylindrical label 4 is cut with laser.SELECTED DRAWING: Figure 13
Inventors:
Adachi Mio
Matsui Shigenori
Matsui Shigenori
Application Number:
JP2016059960A
Publication Date:
April 15, 2020
Filing Date:
March 24, 2016
Export Citation:
Assignee:
Fuji Seal Co., Ltd.
International Classes:
B65B53/00; B23K26/38; B29C63/42; B65D23/08
Domestic Patent References:
| JP2003509298A | ||||
| JP2007216984A | ||||
| JP2013166562A | ||||
| JP2003261171A | ||||
| JP2003020014A | ||||
| JP2015210431A | ||||
| JP2006301136A |
Foreign References:
| US20140029827 |
Attorney, Agent or Firm:
Makoto International Patent Office