Title:
レーザーダイレクトストラクチャリング用ポリアミド樹脂組成物、樹脂成形品、メッキ付樹脂成形品の製造方法および携帯電子機器部品の製造方法
Document Type and Number:
Japanese Patent JP6745226
Kind Code:
B2
Abstract:
PROBLEM TO BE SOLVED: To provide a polyamide resin composition for laser direct structuring capable of providing a resin molded article comprising plating which is hard to peeling and has a high plating growth rate, a resin molded article using the resin composition, a method for producing a resin molded article with plating, and a method for manufacturing a portable electric equipment component.SOLUTION: The polyamide resin composition for laser direct structuring is provided which includes 1-30 pts.wt. of a laser direct structuring addition agent, 1-30 pts.wt. of zinc borate and 10-150 pts.wt. of an inorganic fiber with respect to 100 pts.wt. of a polyamide resin, and in which a content of a flame retardant is 5 pts.wt. or less with respect to 100 pts.wt. of the polyamide resin and is 100 pt.% or less of content of the zinc borate.SELECTED DRAWING: Figure 1
Inventors:
Ryusuke Yamada
Application Number:
JP2017010410A
Publication Date:
August 26, 2020
Filing Date:
January 24, 2017
Export Citation:
Assignee:
Mitsubishi Engineering Plastics Co., Ltd.
International Classes:
C08L77/00; B32B5/02; B32B15/08; B32B27/18; B32B27/34; C08J5/00; C08K3/34; C08K3/38; C08K7/14; H01P11/00
Domestic Patent References:
| JP2015025127A | ||||
| JP2016183422A | ||||
| JP2015108075A |
Foreign References:
| WO2016189023A1 | ||||
| WO2015033955A1 |
Attorney, Agent or Firm:
Patent Service Corporation Patent Office Sykes