Title:
MANUFACTURING METHOD OF POLYAMIDEIMIDE RESIN
Document Type and Number:
Japanese Patent JP2004155947
Kind Code:
A
Abstract:
To provide a polyamideimide resin excellent in electroconductivity, dimensional stability, mechanical strengths, and abrasion resistance.
In this manufacturing method of a polyamideimide resin, polymerization is carried out in a solution with water content of 0.005-0.05wt.%, and the acid component of the polyamideimide resin favorably contains one or two of the compounds from the group consisting of benzophenonetetracarboxylic acid anhydride, biphenyltetracarboxylic acid anhydride, and pyromellitic acid.
Inventors:
INUKAI TADASHI
TACHIKA HIROSHI
YAMADA JUN
TACHIKA HIROSHI
YAMADA JUN
Application Number:
JP2002323991A
Publication Date:
June 03, 2004
Filing Date:
November 07, 2002
Export Citation:
Assignee:
TOYO BOSEKI
International Classes:
C08G73/14; (IPC1-7): C08G73/14
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