Title:
PRESSURE SENSOR MANUFACTURING METHOD
Document Type and Number:
Japanese Patent JP2023099902
Kind Code:
A
Abstract:
To provide a pressure sensor manufacturing method with which it is possible to secure a pressure sensor chip to a sensor case in just a few steps.SOLUTION: This manufacturing method includes a first step in which a pressure sensor chip 16 is bonded to one ends of first and second lead pipes 6, 7, the other ends of which are connected to first and second pressure guide paths for transmitting the pressure to be measured, and the lead pipes 6, 7 are put through first and second through-holes 14, 15 of a case body 11. The manufacturing method includes a second step in which the pressure sensor chip 16 is located to the case body 11, and the first and second lead pipes 6, 7 are soldered to the case body 11. The manufacturing method includes a third step in which the pressure sensor chip 16 and the bonding pads (conductor sections) of the case body 11 are connected by bonding wire. The manufacturing method includes a fourth step in which a lid is joined to an opening of the case body to seal off the inside of the case body.SELECTED DRAWING: Figure 8
Inventors:
TSUSHIMA AYUMI
TOJO HIROSHI
TOJO HIROSHI
Application Number:
JP2022000097A
Publication Date:
July 14, 2023
Filing Date:
January 04, 2022
Export Citation:
Assignee:
AZBIL CORP
International Classes:
G01L19/00
Attorney, Agent or Firm:
Shigeki Yamakawa