Title:
印刷回路基板の製造方法
Document Type and Number:
Japanese Patent JP7045475
Kind Code:
B2
Abstract:
The present invention relates to a method for manufacturing a printed circuit board. A method for manufacturing a printed circuit board according to the present invention comprises the steps of: forming a seed layer on one side of a carrier member to manufacture a transferring film; forming a first circuit pattern on the seed layer; forming an insulation core layer and a metal layer on the first circuit pattern; forming a electroconductive part electrically connecting the first circuit pattern and the metal layer; forming a second circuit pattern by patterning the metal layer; and transferring the first circuit pattern onto the insulation core layer by removing the transferring film.
Inventors:
Chun, Kwan-Chung
Kim, Sohan
Kim, Sohan
Application Number:
JP2020549528A
Publication Date:
March 31, 2022
Filing Date:
November 19, 2018
Export Citation:
Assignee:
INKTEC CO., LTD.
International Classes:
H05K3/46; H05K3/18
Domestic Patent References:
| JP2015508571A | ||||
| JP201559244A | ||||
| JP2016211028A | ||||
| JP6196795A |
Foreign References:
| US20160037619 | ||||
| KR1020100053983A |
Attorney, Agent or Firm:
Maeda/Suzuki International Patent Corporation