To provide a manufacturing method of a probe chip capable of forming the probe chip without using a die for a probe.

In the manufacturing method of a plurality of probe chips formed on a probe support substrate according to the position of an electrode pad of a semiconductor device to be inspected, a resin layer 12 having a shape corresponding to at least the tip of a needle section of the probe chip is formed on the substrate 11 by stereolithography, a mask (resist layers 14a-14c) having an opening corresponding to the shape of the other part of the probe chip is formed on the resin layer 12 by photolithography, and then metal plating layers 16a-16c are formed in an opening part corresponding to the shape of the probe chip by a plating method.