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Patent Searching and Data


Title:
MANUFACTURING METHOD OF RESIN COMPOSITION AND T-DIE FILM, AND FILM
Document Type and Number:
Japanese Patent JP2003221476
Kind Code:
A
Abstract:

To provide a resin composition improved in die line in T-die film working, a manufacturing method of a film made by T-die film working of the resin composition under a high temperature, and a film made by the manufacturing method.

This resin composition contains 80-99 wt.% component (A) and 20-1 wt.% component (B) to the total 100 wt.% of the component (A) and the component (B). Component (A) is an ethylene/α-olefin copolymer satisfying condition A-1: melt flow rate is 1-30 g/10 minute, and A-2: molecular weight distribution is 1-3, and component (B) is an ethylene polymer satisfying condition B-1: melt low rate is 0.1-1 g/10 minute, and B-2: the quantity of a component having a specific molecular chain length is 12-50 wt.%.


Inventors:
OSAKI NOBUHIRO
KANAMORI KAZUNORI
Application Number:
JP2002025102A
Publication Date:
August 05, 2003
Filing Date:
February 01, 2002
Export Citation:
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Assignee:
SUMITOMO CHEMICAL CO
International Classes:
C08J5/18; B29C48/305; C08L23/04; B29K23/00; (IPC1-7): C08L23/04; B29C47/14; C08J5/18
Attorney, Agent or Firm:
Takashi Kuboyama (2 outside)