Title:
MANUFACTURING METHOD OF RESIN FILM FOR MANUFACTURING ELECTRONIC PARTS AND GREEN SHEET, AND MANUFACTURING METHOD OF LAMINATED TYPE ELECTRONIC PARTS
Document Type and Number:
Japanese Patent JP2004200241
Kind Code:
A
Abstract:
To provide manufacturing methods of a resin film for manufacturing electronic parts capable of obtaining a green sheet having a small thickness difference and the green sheet, and a manufacturing method of laminated type electronic parts.
The resin film 1 for manufacturing electronic parts is coated with a ceramic slurry containing an organic component. The value (a CVy value) obtained by dividing the standard deviation value of a Young's modulus in a plane by a mean Young's modulus in the plane is 20% or less.
Inventors:
SUGIMOTO KOUSHIROU
Application Number:
JP2002364257A
Publication Date:
July 15, 2004
Filing Date:
December 16, 2002
Export Citation:
Assignee:
KYOCERA CORP
International Classes:
B28B1/30; H01G4/12; (IPC1-7): H01G4/12; B28B1/30