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Patent Searching and Data


Title:
MANUFACTURING METHOD OF SAW DEVICE
Document Type and Number:
Japanese Patent JP2002290183
Kind Code:
A
Abstract:

To provide a method for manufacturing a SAW device which restricts the deformations of a frame or a lid, by developing within a short time.

The method is provided with a first process for forming an IDT 12 and a connection electrode 13 on the front surface of a piezoelectric baseboard 11, a second process for adhering a photosensitive resin film onto the front surface of the piezoelectric baseboard 11, exposing the developing it and forming the frame 14 which encloses the outer peripheral part of the IDT 12; a third process for making the photosensitive resin film readhere onto the front surface of the piezoelectric resin film, exposing the developing it, forming the lid 15 on the frame 14 and covering the IDT 12 by the frame 14 and the lid 15; and a fourth process for arranging a seal resin 18 for covering the outer periphery of the frame 14 and the lid 15. At least a development in the second process or the third process is conducted by injecting developer, while having the piezoelectric baseboard 11 rotated.


Inventors:
KOGA TAKAFUMI
SAKOTA YOKO
Application Number:
JP2001092497A
Publication Date:
October 04, 2002
Filing Date:
March 28, 2001
Export Citation:
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Assignee:
MATSUSHITA ELECTRIC IND CO LTD
International Classes:
H03H3/08; H03H9/25; (IPC1-7): H03H3/08; H03H9/25
Attorney, Agent or Firm:
Fumio Iwahashi (2 others)