Title:
封着パネルの製造方法
Document Type and Number:
Japanese Patent JP5373605
Kind Code:
B2
Abstract:
A method for manufacturing a sealed panel having a first substrate and a second substrate, including: a melting step of melting a sealing material which does not contain a binder for making the sealing material into paste form; a coating step of applying the melted sealing material onto a surface of the second substrate; and a sealing step of laminating the first substrate and the second substrate via the sealing material applied onto the surface of the second substrate.
Inventors:
Eiichi Iijima
Muneto Hakomori
Toshiharu Kurauchi
Takanobu Yano
Yuichi Orii
Muneto Hakomori
Toshiharu Kurauchi
Takanobu Yano
Yuichi Orii
Application Number:
JP2009517841A
Publication Date:
December 18, 2013
Filing Date:
May 30, 2008
Export Citation:
Assignee:
ULVAC, Inc.
International Classes:
H01J9/26; H01J11/48; H01J17/18
Domestic Patent References:
| JP2003223847A | 2003-08-08 | |||
| JP2002367514A | 2002-12-20 | |||
| JP2002075192A | 2002-03-15 | |||
| JP2002367514A | 2002-12-20 | |||
| JP2003223847A | 2003-08-08 |
Foreign References:
| WO2002013223A1 | 2002-02-14 |
Attorney, Agent or Firm:
Masatake Shiga
Shingo Suzuki
Shingo Suzuki
Previous Patent: JPS5373604
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