Title:
半導体接合ウエハの製造方法
Document Type and Number:
Japanese Patent JP5349892
Kind Code:
B2
Inventors:
Keiichi Takeda
Application Number:
JP2008266260A
Publication Date:
November 20, 2013
Filing Date:
October 15, 2008
Export Citation:
Assignee:
Naoetsu Electronics Industry Co., Ltd.
International Classes:
H01L21/02; H01L21/322; H01L21/336; H01L29/78
Domestic Patent References:
| JP2007073741A | ||||
| JP5055100A |
Attorney, Agent or Firm:
Eichi International Patent Office