Title:
MANUFACTURING METHOD OF SEMICONDUCTOR DEVICE, SEMICONDUCTOR PACKAGE, AND MANUFACTURING METHOD OF SEMICONDUCTOR PACKAGE
Document Type and Number:
Japanese Patent JP2022024547
Kind Code:
A
Abstract:
To provide a manufacturing method of a semiconductor device, a semiconductor package, and a manufacturing method of the semiconductor package that can suppress the peeling of an underfill.SOLUTION: In a manufacturing method of a semiconductor device, a scribe region 4X includes a first region 10 that extends in a first direction, a second region 20 that is located on both sides of the first region in a second direction orthogonal to the first direction in a plan view and extends in the first direction, and a monitor pad 5 provided in the second region. The manufacturing method of a semiconductor device includes a step of irradiating the second region with a laser beam to remove at least a part of the monitor pad 5 before the step of individualizing into a plurality of semiconductor chips. In the step of individualizing into the plurality of semiconductor chips, a semiconductor wafer is cut in the first region.SELECTED DRAWING: Figure 4
Inventors:
SAWADA TOYOJI
Application Number:
JP2020127200A
Publication Date:
February 09, 2022
Filing Date:
July 28, 2020
Export Citation:
Assignee:
SOCIONEXT INC
International Classes:
H01L21/301; H01L21/60
Attorney, Agent or Firm:
Tadashige Ito
Tadahiko Ito
Tadahiko Ito
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