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Title:
Manufacturing method of semiconductor device
Document Type and Number:
Japanese Patent JP6228860
Kind Code:
B2
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Inventors:
Tatsuya Hayashi
Yoshiyuki Ohta
Masayuki Shiina
Application Number:
JP2014024136A
Publication Date:
November 08, 2017
Filing Date:
February 12, 2014
Export Citation:
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Assignee:
Hitachi High-Technologies Corporation
International Classes:
H01L21/3065
Domestic Patent References:
JP2010245101A
JP11260799A
JP2000150632A
JP2006319295A
JP2012094911A
Attorney, Agent or Firm:
Yamato Tsutsui



 
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