Title:
半導体装置の製造方法
Document Type and Number:
Japanese Patent JP7020328
Kind Code:
B2
Abstract:
To provide a method for manufacturing a semiconductor device capable of securing adhesion between a sealing resin body and a lead frame, and wettability by a joining material.SOLUTION: A method for manufacturing a semiconductor device comprises the steps of: preparing a first lead frame 3 including a first inner member 3a and a first outer member 3b in which a first housing part 3c is formed and a second lead frame 7 including a second inner member 7a and a second outer member 7b in which a second housing part 7c is formed; joining a semiconductor element 4 to the first inner member 3a via a first joining material 21, joining a metal block 6 to the semiconductor element via a second joining material 22, and joining the second inner member 7a to the metal block via a third joining material 23; roughing a surface with which a sealing resin body 5 comes into contact among surfaces of the first outer member 3b and the second outer member 7b; housing the first inner member 3a in the first housing part 3c, housing the second inner member 7a in the second housing part 7c, and manufacturing a device body 1a; and molding the sealing resin body 5 so as to cover at least a roughed surface among the surfaces of the first lead frame 3 and the second lead frame 7, the semiconductor element 4, and the metal block 6.SELECTED DRAWING: Figure 3
Inventors:
Keigo Inaba
Application Number:
JP2018138719A
Publication Date:
February 16, 2022
Filing Date:
July 24, 2018
Export Citation:
Assignee:
TOYOTA JIDOSHA KABUSHIKI KAISHA
International Classes:
H01L23/50; H01L21/52
Domestic Patent References:
| JP2012243890A | ||||
| JP2002329828A | ||||
| JP2014138162A | ||||
| JP2009070910A |
Attorney, Agent or Firm:
Hiraki International Patent Office