Title:
半導体装置の製造方法、及び電子機器の製造方法
Document Type and Number:
Japanese Patent JP5853382
Kind Code:
B2
Abstract:
A semiconductor manufacturing apparatus includes: a treatment chamber treating a treated film of a wafer using a desired chemical fluid; a film thickness measurement unit measuring an initial film thickness of the treated film before treatment and a final film thickness of the treated film after treatment; and a main body controlling unit calculating a treatment speed of the chemical fluid from the initial film thickness, the final film thickness, and a chemical fluid treatment time taken from the initial film thickness to the final film thickness to calculate a chemical fluid treatment time for a wafer to be treated next from the calculated treatment speed.
Inventors:
Yukari Takeya
Iwamoto Hayato
Kenya Hagimoto
Eizo Motooka
Iwamoto Hayato
Kenya Hagimoto
Eizo Motooka
Application Number:
JP2011054702A
Publication Date:
February 09, 2016
Filing Date:
March 11, 2011
Export Citation:
Assignee:
ソニー株式会社
International Classes:
H01L21/306
Domestic Patent References:
| JP2002151465A | ||||
| JP11251288A | ||||
| JP2006344641A | ||||
| JP11220005A | ||||
| JP2000031132A | ||||
| JP2002143790A | ||||
| JP2003243662A |
Attorney, Agent or Firm:
Shinto International Patent Office