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Patent Searching and Data


Title:
半導体装置の製造方法
Document Type and Number:
Japanese Patent JP4966490
Kind Code:
B2
Abstract:

To manufacture a semiconductor device having a silicon-containing electrode on a high dielectric film composed of a MISFET and a MIS capacitor having an excellent reliability for a prolonged term and having a high performance.

In a process, the high dielectric film is formed on a semiconductor substrate. In the process, a first heat treatment (a first PDA) in an oxidizing atmosphere is carried out to the high dielectric film. In the process, a silicon nitride layer is formed on the surface of the high dielectric film after the first PDA. In the process, a second heat treatment (a second PDA) is carried out to the high dielectric film coated with the silicon nitride layer and the silicon nitride layer. In the process, a silicon-containing semiconductor film or a conductor film is formed on the silicon nitride layer. The MISFET or the like having the excellent reliability for the prolonged term and the high performance can be realized by forming a high dielectric gate insulating film and a gate electrode or the like through these processes.

COPYRIGHT: (C)2006,JPO&NCIPI


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Inventors:
Yasuyuki Tamura
Application Number:
JP2004330182A
Publication Date:
July 04, 2012
Filing Date:
November 15, 2004
Export Citation:
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Assignee:
Fujitsu Semiconductor Limited
International Classes:
H01L29/78; H01L21/336; H01L21/822; H01L21/8238; H01L21/8242; H01L27/04; H01L27/092; H01L27/108
Domestic Patent References:
JP2004303894A
JP2004031394A
JP2003273348A
JP2004289082A
JP2004523134A
JP11121453A
JP2004079659A
JP2003008011A
Foreign References:
WO2004053997A1
Attorney, Agent or Firm:
Mitsuyuki Matsuyama
Tetsuma Ikegami
Akira Sudo
Junichi Yokoyama