Title:
半導体装置の製造方法および半導体装置
Document Type and Number:
Japanese Patent JP4979283
Kind Code:
B2
Abstract:
The performance of a sensor in a semiconductor device can be improved. A plurality of oscillators forming an ultrasonic sensor are arranged on a main surface of a semiconductor chip. A negative-type photosensitive insulating film which protects the oscillators is deposited on an uppermost layer of the semiconductor chip. At the time of exposure for forming an opening in the photosensitive insulating film, the semiconductor chip is divided into a plurality of exposure areas and exposed, and then, the exposure areas are jointed so that the entire area is exposed. At this time, a stitching exposure area is arranged so that a center of the stitching exposure area in a width direction in the joint portion of the adjacent exposure areas is positioned at a center of a line which connects centers of oscillators located above and below the stitching exposure area.
Inventors:
Hiroyuki Enomoto
Katsuya Hayano
Shuntaro Machida
Katsuya Hayano
Shuntaro Machida
Application Number:
JP2006178969A
Publication Date:
July 18, 2012
Filing Date:
June 29, 2006
Export Citation:
Assignee:
株式会社日立製作所
International Classes:
G01S7/521; H01L21/02; H04R19/00; H04R31/00
Domestic Patent References:
| JP2001502871A | ||||
| JP5107547A | ||||
| JP2003500955A |
Attorney, Agent or Firm:
Yamato Tsutsui