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Title:
半導体装置の製造方法
Document Type and Number:
Japanese Patent JP5055779
Kind Code:
B2
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Inventors:
Iwamoto Hayato
Takahiro Katagiri
Application Number:
JP2006032676A
Publication Date:
October 24, 2012
Filing Date:
February 09, 2006
Export Citation:
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Assignee:
ソニー株式会社
International Classes:
H01L29/78; H01L21/20; H01L21/336; H01L21/8238; H01L27/092
Domestic Patent References:
JP2003174159A
JP2002530864A
JP8153688A
Attorney, Agent or Firm:
Takahisa Sato



 
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