Title:
半導体装置の製造方法と半導体装置
Document Type and Number:
Japanese Patent JPWO2002059902
Kind Code:
A
Inventors:
Nakahara 茂
Naomi Oshima
Keiichi Higeta
Takashi Koba
Wood Hideki
Naomi Oshima
Keiichi Higeta
Takashi Koba
Wood Hideki
Application Number:
JP2001009245W
Publication Date:
August 01, 2002
Filing Date:
October 22, 2001
Export Citation:
Assignee:
株式会社日立製作所
株式会社日立超エル・エス・アイ・システムズ
株式会社日立超エル・エス・アイ・システムズ
International Classes:
(IPC1-7): G11C29/00; G01R31/28; H01L21/02
Attorney, Agent or Firm:
Mitsumasa Tokuwaka
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