Title:
半導体パッケージ基板の製造方法
Document Type and Number:
Japanese Patent JP6849799
Kind Code:
B2
Abstract:
A method of manufacturing a semiconductor package substrate includes forming a trench in one surface of a base substrate formed of a conductive material, performing a first filling operation of filling the trench with resin, performing a first curing operation of semi-curing the resin filled in the first filling operation, performing a second filling operation of additionally filling resin on a semi-cured resin, performing a second curing operation of fully curing the resin, removing the resin exposed from the trench, and etching an opposite surface of the base substrate to expose at least part of the resin filling the trench.
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Inventors:
In Soup Bae
Hyuk Jin Chung
Hyuk Jin Chung
Application Number:
JP2019524174A
Publication Date:
March 31, 2021
Filing Date:
December 05, 2016
Export Citation:
Assignee:
Hesson DS Company Limited
International Classes:
H01L23/12; H01L23/50
Domestic Patent References:
| JP2010080895A | ||||
| JP2004071946A |
Attorney, Agent or Firm:
Yasuhiko Murayama
Shinya Mitsuhiro
Tatsuhiko Abe
Shinya Mitsuhiro
Tatsuhiko Abe