Title:
半導体パッケージ用基板および半導体パッケージ用基板の製造方法
Document Type and Number:
Japanese Patent JPWO2011007507
Kind Code:
A
Inventors:
Akinobu Shibuya
Ochi 明
Ochi 明
Application Number:
JP2010004239W
Publication Date:
December 20, 2012
Filing Date:
June 25, 2010
Export Citation:
Assignee:
NEC Corp.
International Classes:
H01L23/28; H01L23/12; H01L21/60
Attorney, Agent or Firm:
家入 健