Title:
センサデバイスの製造方法及びセンサデバイス
Document Type and Number:
Japanese Patent JP4968371
Kind Code:
B2
Abstract:
A method for manufacturing a sensor device is provided. The method prevents corrosion of metal electrodes of a sensor due to outside air with high humidity and preventing the occurrence of warpage of the sensor due to resin sealing of the sensor, thereby reducing the influence on sensor characteristics, and provides the sensor device. The method includes arranging a sensor on a substrate, the sensor having a fixed part, a movable part positioned inside the fixed part, a flexible part connecting the fixed part and the movable part, and a plurality of metal electrodes, electrically connecting the plurality of metal electrodes of the sensor and a plurality of terminals of the substrate with bonding wires, and covering portions of the plurality of metal electrodes of the sensor connected to the bonding wires with a resin so that a part of the bonding wires between the plurality of metal electrodes and the plurality of terminals is exposed.
Inventors:
Takamasa Takano
Application Number:
JP2010150109A
Publication Date:
July 04, 2012
Filing Date:
June 30, 2010
Export Citation:
Assignee:
Dai Nippon Printing Co.,Ltd.
International Classes:
G01P15/08; B81B3/00; B81C1/00; G01P15/12; H01L21/60; H01L25/16; H01L29/84
Domestic Patent References:
| JP200290245A | ||||
| JP2006145410A | ||||
| JP62144368A |
Attorney, Agent or Firm:
Takahashi Hayashi & Partners