Title:
センサーモジュールの製造方法
Document Type and Number:
Japanese Patent JP7247698
Kind Code:
B2
Abstract:
To obtain a higher detection characteristic in a sensor module of the type that detects the vibration of air, etc., via an open hole provided in a substrate.SOLUTION: A sensor module 1 comprises: a substrate 10 having an open hole 11 and a plurality of land patterns 12; a sensor chip 20 having a detection unit 22 and a plurality of electrode pads 23 and mounted on the substrate 10 so that the detection unit 22 overlaps the open hole 11 and the plurality of electrode pads 23 are connected to the plurality of land patterns 12 via a connecting member 51; and an encapsulant 60 provided on the substrate 10 along the outer circumference of the sensor chip 20 so as to fill a gap between the outer circumference of the sensor chip 20 and the substrate 10. Thus, as a gap between the outer circumference of the sensor chip 20 and the substrate 10 is filled with the encapsulant 60, it is possible for the detection unit 22 of the sensor chip 20 to detect the vibration of air, etc., with high sensitivity via the open hole 11 provided in the substrate 10.SELECTED DRAWING: Figure 1
Inventors:
Tsutomu Yasui
Yoshino Jun
Yoshino Jun
Application Number:
JP2019058702A
Publication Date:
March 29, 2023
Filing Date:
March 26, 2019
Export Citation:
Assignee:
tdk Corporation
International Classes:
G01L9/00; H01L23/02; H01L29/84
Domestic Patent References:
| JP2007248212A | ||||
| JP2004135192A | ||||
| JP2009033333A | ||||
| JP2003142524A | ||||
| JP10116935A | ||||
| JP2018517572A | ||||
| JP2011114054A | ||||
| JP9101220A |
Foreign References:
| CN103400812A |
Attorney, Agent or Firm:
Mitsuhiro Washito
Ogata Japanese
Ogata Japanese