Title:
銀粒子粉末の製造方法
Document Type and Number:
Japanese Patent JP4660780
Kind Code:
B2
Abstract:
A fine silver particle powder is provided that is a suitable material for interconnects used to form fine circuit patterns especially by the inkjet method, and a method of manufacturing the powder. Although the powder is fine and therefore has a large specific surface area, it has good weatherability and corrosion resistance. The powder particles have a calculated specific surface area (CS) of 50 m 2 /cm 3 or more, an X-ray crystal grain diameter (Dx) of not more than 50 nm, not more than 10.0 basicity points/nm 2 and not more than 10.0 acidity points/nm 2 . To obtain the silver particle powder, a silver compound is reduced in an organic solvent, using as the reducing agent one, two or more selected from an alcohol or polyol. The reduction reaction proceeds in the presence of an organic protective agent and a polarity inhibition agent.
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Inventors:
King Sato
Application Number:
JP2005056035A
Publication Date:
March 30, 2011
Filing Date:
March 01, 2005
Export Citation:
Assignee:
dowa Electronics Co., Ltd.
International Classes:
B22F9/24; B22F1/05; B22F1/054; B22F1/102; C09C1/62; C09C3/08
Domestic Patent References:
| JP2004273205A | ||||
| JP2005036309A | ||||
| JP2004027347A | ||||
| JP10046048A |
Attorney, Agent or Firm:
Kenji Wada
Komatsu Taka
Komatsu Taka