Title:
METHOD FOR MANUFACTURING SUBSTRATE LAMINATE
Document Type and Number:
Japanese Patent JP2023147492
Kind Code:
A
Abstract:
To provide a method for manufacturing a substrate laminate that can secure the height of an adhesive layer and the area of a top surface even when the adhesive layer is thickened.SOLUTION: A method for manufacturing a substrate laminate includes a step A for forming a pattern 12 of a curable resin composition on a first substrate 11 by using a printing method, a step B for semi-curing the pattern 12 of the curable resin composition, a step C for forming a pattern 12 of the curable resin composition on a pattern 13 of a semi-cured material of the curable resin composition by using the printing method, a step D for molding the pattern 13 of the semi-cured material of the curable resin composition formed in the step B and the pattern 12 of the curable resin composition formed in the step C by using a mold M to form a pattern of a laminate of the curable resin composition, and a step E for arranging the first substrate and a second substrate via the pattern of the laminate of the curable resin composition and curing the pattern of the laminate of the curable resin composition.SELECTED DRAWING: Figure 1
Inventors:
SOHO SAKI
FUJISHITA AYAKA
NISHIHIRA NARIYOSHI
SAITO YUZURU
FUJISHITA AYAKA
NISHIHIRA NARIYOSHI
SAITO YUZURU
Application Number:
JP2022055013A
Publication Date:
October 13, 2023
Filing Date:
March 30, 2022
Export Citation:
Assignee:
KANEKA CORP
International Classes:
H01L23/02; B05D1/36; B05D3/12; B05D5/06; B32B27/00; B32B37/10; B32B38/14
Attorney, Agent or Firm:
Yuichi Niiyama
Ryuta Kato
Ryuta Kato