Title:
回路付サスペンション基板および回路付サスペンション基板の製造方法
Document Type and Number:
Japanese Patent JP6951240
Kind Code:
B2
Abstract:
A suspended substrate with a circuit, and a manufacturing method thereof are provided. The suspended substrate with a circuit includes a metal supporting layer; a conductor pattern including a terminal disposed on one side in the thickness direction of the metal supporting layer; and an insulating layer insulating the metal supporting layer from the conductor pattern. The terminal has: another endsurface in the thickness direction which is exposed from the metal supporting layer and the insulating layer; and a peripheral end surface which is covered by the insulating layer. The insulating layer includes a peripheral portion that surrounds the periphery of the terminal and covers the peripheral end surface, and a plating layer is provided on the other end surface in the thickness directionof the terminal. The plating layer includes a protective portion disposed at the other end surface in the thickness direction of the terminal, and a protruding portion that is continuous with the protective portion and protrudes toward the other side in the thickness direction so as to mesh with the peripheral portion.
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Inventors:
Takatoshi Sakakura
Application Number:
JP2017250989A
Publication Date:
October 20, 2021
Filing Date:
December 27, 2017
Export Citation:
Assignee:
NITTO DENKO CORPORATION
International Classes:
G11B5/60; G11B21/21; H05K1/05; H05K3/24
Domestic Patent References:
| JP2001352137A | ||||
| JP2010040116A | ||||
| JP2017162543A | ||||
| JP2017098306A | ||||
| JP2016009513A |
Foreign References:
| WO2017169760A1 | ||||
| US20050138794 |
Attorney, Agent or Firm:
Hiroyuki Okamoto
Shinichi Uda
Shinichi Uda