Title:
超音波センサの製造方法
Document Type and Number:
Japanese Patent JP4900066
Kind Code:
B2
Abstract:
A method of manufacturing an ultrasonic sensor including a case, a piezoelectric element having first and second electrodes, and a conductive member having first and second conductive parts is disclosed. The method includes the steps of a) forming the conductive member by integrally forming the first and second conductive parts and a joining part that joins portions of the first and second conductive parts, b) mounting the piezoelectric element and the conductive member in the case so that the first conductive part is connected to the first electrode and the second conductive part is connected to the second electrode, and the joining part and the portions of the first and second conductive parts joined by the joining part are positioned outside of the case, c) supplying a filling material into the case, and d) removing the joining part after step c).
Inventors:
Kenichi Furukawa
Application Number:
JP2007155271A
Publication Date:
March 21, 2012
Filing Date:
June 12, 2007
Export Citation:
Assignee:
MITSUMI ELECTRIC CO.,LTD.
International Classes:
H04R31/00; H04R17/00
Domestic Patent References:
JP2001128293A | ||||
JP57090986A | ||||
JP11330578A | ||||
JP2002218578A | ||||
JP2004106059A | ||||
JP2005228496A | ||||
JP2000350295A | ||||
JP4293094A | ||||
JP7098589A | ||||
JP2001085259A |
Attorney, Agent or Firm:
Tadahiko Ito