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Patent Searching and Data


Title:
MANUFACTURING METHOD OF VERY THIN WIRE OR COATED VERY THIN WIRE
Document Type and Number:
Japanese Patent JP2002208323
Kind Code:
A
Abstract:

To manufacture a high quality very thin wire or coated very thin wire that is suitable for the wiring of electric or electronic equipment.

A process of coating metal A or resin A on a conductive metal element wire in layer-form of 1-100% of thickness of the above conductive element wire, a process of reducing diameter of the coated element wire, a process of removing the coated layer of the coated element wire after the reducing process, and a process of coating the metal A or resin A in layer-form on the element wire (very thin wire) that is removed of the above coated layer are made consecutively in this order. As the conductive metal element wire is coated with metal A or resin A in layer-form and reducing-processed, the surface flaw of the conductive metal element wire is hardly caused, or foreign matters are hardly mixed in, thus the very thin wire obtained by removing the coated layer has a high quality.


Inventors:
SUZUKI YUJI
FUJIWARA HIDEMICHI
Application Number:
JP2001002966A
Publication Date:
July 26, 2002
Filing Date:
January 10, 2001
Export Citation:
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Assignee:
FURUKAWA ELECTRIC CO LTD
International Classes:
B21C1/00; B21C9/00; C23C26/00; C25D7/06; H01B13/00; (IPC1-7): H01B13/00; B21C1/00; B21C9/00; C23C26/00; C25D7/06